European semiconductor alliance calls for expedited assistance and policy transformation
Rawat further suggested that the revised ‘Chips Act 2.0’ must incorporate provisions for agility and flexibility to promptly address industry dynamics and geopolitical dynamics.
Rawat further suggested that the revised ‘Chips Act 2.0’ must incorporate provisions for agility and flexibility to promptly address industry dynamics and geopolitical dynamics. This will ensure that the strategy of the EU remains pertinent and efficient within the changing semiconductor domain.
Overcoming limitations on exports
One of the primary hurdles has been the imposition of trade constraints on firms such as ASML concerning exports to China. The ESIA has recommended a more positive stance, promoting incentives instead of resorting to protectionism. “By restricting the sale of cutting-edge semiconductor manufacturing equipment, European businesses may jeopardize significant revenue streams, potentially weakening Europe’s standing as a frontrunner in this advanced sector,” highlighted Rawat. “Furthermore, the contraction of the market could result in a decrease in investments in research and development, ultimately impeding innovation within the semiconductor landscape in Europe.”
Moreover, these limitations might provoke retaliatory measures from the impacted nations, potentially disrupting global supply chains and escalating operational expenses for European enterprises.
