Apple, Amkor, and TSMC ‘neath the Arizona Skies

CoWoS might offer intriguing possibilities for Apple, being an advanced chip packaging technology that adeptly connects graphics processors, memory, and CPU. There could be certain ramifications for Apple’s transition to 2nm chips (produced by TSMC, crafted by Apple’s silicon units, and grounded on Arm blueprint designs) by 2025.

TSMC Chairman and CEO C.C. Wei touched upon this earlier in the year, expressing to Nikkei, “AI is in such demand that all my clients want to incorporate AI into their gadgets.” As past events indicate, Apple has indeed achieved just that and Nvidia utilizes CoWoS chip packaging technology in its powerful graphics processors.

What the collaborators said

Digressing from the assumptions, here’s Amkor and TSMC’s perspective as declared in a public release: “Amkor takes pride in partnering with TSMC to ensure smooth fusion of silicon manufacturing and packaging techniques via a streamlined all-inclusive advanced packaging and testing business framework in the United States,” stated Giel Rutten, president and CEO of Amkor. “This extended alliance demonstrates our dedication to fostering innovation and propelling semiconductor technology forward while guaranteeing robust supply chains.”

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AndyC

Andy Curtis is an award-winning security consultant, researcher and public speaker. He has been working in the computer security industry since the early 1990s, having been employed by state and federal government, leading healthcare and banking providers across three continents. He has given talks about computer security for some of the world’s largest companies, worked with law enforcement agencies on investigations into hacking groups, and is a regular voice on TV and radio explaining IT security threats.

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